The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Jul. 27, 2009
Hideki Takakuwa, Shizuoka-ken, JP;
Kaoru Aoyagi, Shizuoka-ken, JP;
Kazuto Shimada, Shizuoka-ken, JP;
Hideki Takakuwa, Shizuoka-ken, JP;
Kaoru Aoyagi, Shizuoka-ken, JP;
Kazuto Shimada, Shizuoka-ken, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
A photosensitive resin composition is provided which provides a high resolution even when a pattern is formed using a low exposure intensity (in particular, less than 200 mJ/cm) and may inhibit deterioration in pattern rectangularity during a post baking process of a post treatment. The photosensitive resin composition includes: a resin; an oxime photopolymerization initiator; a UV absorbing agent; and a monomer containing a hydrogen bonding group, the amount of the monomer containing a hydrogen bonding group being 30 mass % or more with respect to the total solid content of the composition, and the photosensitive resin composition is used for forming a solid-state imaging device.