The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
May. 29, 2006
Applicants:
Kenji Saito, Ibaraki, JP;
Tokumi Ikeda, Osaka, JP;
Tamao Higuchi, Aichi, JP;
Inventors:
Assignees:
High Energy Accelerator Research Organization, Ibaraki, JP;
Nomura Plating Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/02 (2006.01); C25D 5/12 (2006.01); C25D 5/10 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
Abstract
In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.