The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2013

Filed:

Nov. 19, 2010
Applicants:

Wayne Samuel Davis, Harrisburg, PA (US);

Robert Neil Whiteman, Jr., Middletown, PA (US);

Inventors:

Wayne Samuel Davis, Harrisburg, PA (US);

Robert Neil Whiteman, Jr., Middletown, PA (US);

Assignee:

Tyco Electronics Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrical connector system may include a plurality of wafer assemblies. Each wafer assembly may include a first overmolded array of electrical contacts defining a plurality of apertures; a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, the second overmolded array of electrical contacts defining a plurality of apertures; and a conductive ground bracket positioned in the wafer assembly between the first overmolded array of electrical contacts and the second array of electrical contacts. The conductive ground bracket defines a first array of ridges, each ridge of the first array of ridges positioned in an aperture of the first overmolded array of electrical contacts. The conductive ground bracket defines a second array of ridges, each ridge of the second array of ridges positioned in an aperture of the second overmolded array of electrical contacts.


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