The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Feb. 15, 2007
Bruno Lefevre, Draveil, FR;
Christian Schwartz, Chatou, FR;
Jean-yves Moreno, Meru, FR;
Valeo Systemes de Controle Moteur, Cergy Saint Christophe, FR;
Abstract
A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.