The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Dec. 15, 2011
Katsumi Tanaka, Tokyo, JP;
Kenichi Shinozaki, Tokyo, JP;
Tetsuya Okumura, Tokyo, JP;
Makoto Kikuta, Tokyo, JP;
Masami Sano, Tokyo, JP;
Taro Mogi, Tokyo, JP;
Katsumi Tanaka, Tokyo, JP;
Kenichi Shinozaki, Tokyo, JP;
Tetsuya Okumura, Tokyo, JP;
Makoto Kikuta, Tokyo, JP;
Masami Sano, Tokyo, JP;
Taro Mogi, Tokyo, JP;
Kabushiki Kaisha Nihon Micronics, Tokyo, JP;
Abstract
A wire forming device for applying a paste material on an insulating substrate to form a wiring pattern. The wire forming device includes a paste material application unit which includes an atomizing unit atomizing the paste material and a nozzle spraying the atomized paste material onto the insulating substrate. The atomizing unit includes: a medium supplying portion which mixes a medium with a carrier gas to form a mixed gas and an atomizing portion. The atomizing portion holds the paste material and brings the mixed gas into contact with the paste material to atomize the paste material, thereby making a mist stream of the mixed gas and the paste material as the atomized paste material fed to the nozzle. The wire forming further includes a mixing ratio adjusting unit adjusting a mixing ratio of the paste material to the mixed gas in the mist stream.