The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
May. 18, 2011
Applicant:
Harry K. Charles, Jr., Laurel, MD (US);
Inventor:
Harry K. Charles, Jr., Laurel, MD (US);
Assignee:
The Johns Hopkins University, Baltimore, MD (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
Thinned die are attached to a flexible substrate and the die-substrate assembly is formed (wound) around multiple horizontal fingers of a heat removal buss structure such that the substrate below each die is in contact with one of the fingers. The fingers connect to a vertical support member that provides stability and a means of connecting the heat removal buss structure to the ambient.
Charles, Jr., Harry. (2013). Apparatus and methods for 3-d stacking of thinned die (U.S. Patent No. 8466563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8466563
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile