The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Feb. 16, 2011
Electronic device having interconnections, openings, and pads having greater width than the openings
Ji-yong Park, Yongin-si, KR;
Hee-seok Lee, Yongin-si, KR;
Chul-woo Kim, Incheon, KR;
Sang-gui JO, Seoul, KR;
Kwang-jin Bae, Suwon-si, KR;
Seung-hwan Kim, Incheon, KR;
Ji-Yong Park, Yongin-si, KR;
Hee-Seok Lee, Yongin-si, KR;
Chul-Woo Kim, Incheon, KR;
Sang-Gui Jo, Seoul, KR;
Kwang-Jin Bae, Suwon-si, KR;
Seung-Hwan Kim, Incheon, KR;
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.