The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Sep. 23, 2011
Kentaro Ochi, Hitachi, JP;
Akira Mishima, Mito, JP;
Takuro Kanazawa, Hitachinaka, JP;
Tetsuo Iijima, Maebashi, JP;
Katsuo Ishizaka, Kitagunma-gun, JP;
Norio Kido, Maebashi, JP;
Kentaro Ochi, Hitachi, JP;
Akira Mishima, Mito, JP;
Takuro Kanazawa, Hitachinaka, JP;
Tetsuo Iijima, Maebashi, JP;
Katsuo Ishizaka, Kitagunma-gun, JP;
Norio Kido, Maebashi, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. The third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.