The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2013

Filed:

Oct. 17, 2011
Applicants:

Ryotaro Seo, Aichi, JP;

Tohru Itoh, Aichi, JP;

Yukihiko Tsukuda, Aichi, JP;

Tomoyasu Yamada, Aichi, JP;

Inventors:

Ryotaro Seo, Aichi, JP;

Tohru Itoh, Aichi, JP;

Yukihiko Tsukuda, Aichi, JP;

Tomoyasu Yamada, Aichi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate.


Find Patent Forward Citations

Seo, Ryotaro. (2013). Imaging device package, method of manufacturing the imaging device package, and electronic apparatus (U.S. Patent No. 8466531). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8466531

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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