The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Oct. 10, 2006
Pei-chung Wang, Troy, MI (US);
John D. Fickes, Brighton, MI (US);
Pei-Chung Wang, Troy, MI (US);
John D. Fickes, Brighton, MI (US);
GM Global Technology Operations LLC, Detroit, MI (US);
Abstract
A method of repairing a bonded metallic structure having a first metallic member bonded to a second metallic member is provided. The method includes the steps of: A) forming a hole in at least one of the first metallic member and second metallic member, wherein said hole is sufficiently configured to receive a slug; B) inserting said slug into said hole; and C) passing electrical current through said slug of sufficient intensity to promote melting at the interface between the first metallic member, second metallic member, and said slug, thereby securing the first metallic member with respect to the second metallic member. Alternately, the method may include: D) positioning said slug near said hole; E) passing electrical current through said slug of sufficient intensity to promote arcing between said slug and the bonded metallic structure; and F) inserting said slug into said hole thereby securing the first metallic member with respect to the second metallic member.