The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Feb. 24, 2010
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-hung Cheng, Wugu Township, Taipei County, TW;
Chen-hsiang Lin, Wugu Township, Taipei County, TW;
Kuo-len Lin, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-Hung Cheng, Wugu Township, Taipei County, TW;
Chen-Hsiang Lin, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Golden Sun News Techniques Co., Ltd., New Taipei, TW;
CPUMate Inc., New Taipei, TW;
Abstract
A cooling rack structure includes a cooling plate (), a temperature conductor (), a centrifugal fan (), a cooling body () and a thermoelectric cooling component (). A temperature-super-conducting component () is disposed on an inner surface () of the cooling plate (). The temperature conductor () is arranged on the temperature-super-conducting component (). In addition, a heat-exhausting hole () is arranged on an upper side of the cooling plate (). The centrifugal fan () is disposed between the temperature conductor () and the heat-exhausting hole () while the cooling body () is disposed between the fan () and the heat-exhausting hole (). A hot side face () of the thermoelectric cooling component () closely contacts the cooling body () while a cold side face () is arranged on the temperature-super-conducting component (). By quickly conducting the low temperature generated from the thermoelectric cooling component () onto the cooling plate () through the temperature-super-conducting component (), a low temperature surface can be uniformly provided to obtain a cooling effect.