The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2013

Filed:

Feb. 25, 2011
Applicants:

Yi-hwa Hsieh, Taoyuan Hsien, TW;

Yao-cheng Chen, Taoyuan Hsien, TW;

Inventors:

Yi-Hwa Hsieh, Taoyuan Hsien, TW;

Yao-Cheng Chen, Taoyuan Hsien, TW;

Assignee:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.


Find Patent Forward Citations

Hsieh, Yi-Hwa. (2013). Heat-dissipating module and electronic device using same (U.S. Patent No. 8462509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8462509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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