The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2013

Filed:

Oct. 25, 2012
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Min-Ho Oh, Yongin-si, KR;

Yoon-Hyeung Cho, Yongin-si, KR;

Yong-Tak Kim, Yongin-si, KR;

So-Young Lee, Yongin-si, KR;

Sang-Hwan Cho, Yongin-si, KR;

Byoung-Duk Lee, Yongin-si, KR;

Sun-Young Jung, Yongin-si, KR;

Yun-Ah Chung, Yongin-si, KR;

Soo-Youn Kim, Yongin-si, KR;

Dong-Jin Kim, Yongin-si, KR;

Ji-Young Moon, Yongin-si, KR;

Seung-Yong Song, Yongin-si, KR;

Jong-Hyuk Lee, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 33/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Thin film encapsulation for a flat panel display device and a method of manufacturing the thin film encapsulation structure. The thin film encapsulation structure of the flat panel display device includes thin film layers covering a display unit formed on a substrate, wherein the thin film layers comprise a plurality of inorganic layers and a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers. Accordingly, as multiple layers of the thin film encapsulation structure may be formed in a single chamber, the manufacturing process may be simplified, and also, as the HMDSO layer, which is flexible, absorbs stresses, a risk of cracks occurring may also be reduced.


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