The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
May. 24, 2011
Applicant:
Takeshi Sugiyama, Chiba, JP;
Inventor:
Takeshi Sugiyama, Chiba, JP;
Assignee:
Seiko Instruments Inc., Chiba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. The wafers has a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, and grooves or slits are formed extending from the central portion in radial direction to the outside in radial direction of the wafer and reaching the outside of the product area.