The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2013

Filed:

Apr. 20, 2009
Applicants:

Thomas Zeiler, Nittendorf, DE;

Reiner Windisch, Pettendorf, DE;

Stefan Gruber, Bad Abbach, DE;

Markus Kirsch, Brunn, DE;

Julius Muschaweck, Gauting, DE;

Torsten Baade, Regensburg, DE;

Herbert Brunner, Sinzing, DE;

Steffen Köhler, Penang, MY;

Inventors:

Thomas Zeiler, Nittendorf, DE;

Reiner Windisch, Pettendorf, DE;

Stefan Gruber, Bad Abbach, DE;

Markus Kirsch, Brunn, DE;

Julius Muschaweck, Gauting, DE;

Torsten Baade, Regensburg, DE;

Herbert Brunner, Sinzing, DE;

Steffen Köhler, Penang, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/048 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.


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