The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Aug. 25, 2009
Bert Braune, Wenzenbach, DE;
Jörg Erich Sorg, Regensburg, DE;
Walter Wegleiter, Nittendorf, DE;
Karl Weidner, Munich, DE;
Oliver Wutz, Regensburg, DE;
Bert Braune, Wenzenbach, DE;
Jörg Erich Sorg, Regensburg, DE;
Walter Wegleiter, Nittendorf, DE;
Karl Weidner, Munich, DE;
Oliver Wutz, Regensburg, DE;
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Abstract
An optoelectronic module is described including a carrier substrate and a plurality of radiation-emitting semiconductor components. The carrier substrate includes structured conductor tracks. The radiation-emitting semiconductor components each include an active layer suitable for generating electromagnetic radiation, a first contact area and a second contact area. The first contact area is in each case arranged on that side of the radiation-emitting semiconductor components that is remote from the carrier substrate. The radiation-emitting semiconductor components are provided with an electrically insulating layer, which in each case has a cutout in a region of the first contact area. Conductive structures are arranged in regions on the electrically insulating layer. One of the conductive structures electrically conductively connects at least the first contact area of a radiation-emitting semiconductor component to a further first contact area of a further radiation-emitting semiconductor component or to a conductor track of the carrier substrate. A method for producing such a module is also described.