The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
May. 10, 2010
Shinji Maekawa, Shizuoka, JP;
Gen Fujii, Kanagawa, JP;
Junya Maruyama, Kanagawa, JP;
Toru Takayama, Kanagawa, JP;
Yumiko Fukumoto, Kanagawa, JP;
Yasuyuki Arai, Kanagawa, JP;
Shinji Maekawa, Shizuoka, JP;
Gen Fujii, Kanagawa, JP;
Junya Maruyama, Kanagawa, JP;
Toru Takayama, Kanagawa, JP;
Yumiko Fukumoto, Kanagawa, JP;
Yasuyuki Arai, Kanagawa, JP;
Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;
Abstract
An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.