The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2013

Filed:

Apr. 18, 2011
Applicants:

Lars Markwort, Haimhausen, DE;

Pierre-yves Guittet, Munich, DE;

Sandip Halder, Leuven, BE;

Anne Jourdain, Leuven, BE;

Inventors:

Lars Markwort, Haimhausen, DE;

Pierre-Yves Guittet, Munich, DE;

Sandip Halder, Leuven, BE;

Anne Jourdain, Leuven, BE;

Assignees:

Nanda Technologies GmbH, Unterschleissheim, DE;

IMEC, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.


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