The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Jul. 10, 2009
Applicants:
Jun Zheng, Edina, MN (US);
Dadi Setiadi, Edina, MN (US);
Inventors:
Jun Zheng, Edina, MN (US);
Dadi Setiadi, Edina, MN (US);
Assignee:
Seagate Technology LLC, Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.