The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2013

Filed:

May. 04, 2009
Applicants:

Jun Ishii, Osaka, JP;

Hitoki Kanagawa, Osaka, JP;

Inventors:

Jun Ishii, Osaka, JP;

Hitoki Kanagawa, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/17 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A producing method of a wired circuit board includes a laminating step of preparing a metal supporting board, forming an insulating base layer on the metal supporting board, forming a conductive layer including a terminal portion and a plating lead continued from the terminal portion on the insulating base layer, and forming an insulating cover layer on the insulating base layer so as to cover the conductive layer, a first etching step of etching the metal supporting board, and then etching the insulating base layer to expose the plating lead from the metal supporting board and the insulating base layer, and a second etching step of etching the exposed plating lead.


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