The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Jun. 21, 2010
William Allen Rogers, Jr., Marysville, OH (US);
Christopher Paul Weil, Pickerington, OH (US);
Robert Dwayne Litt, Westerville, OH (US);
Ronald Chester Pasadyn, Missouri City, TX (US);
George Bradley Smith, Rock Hill, SC (US);
Charles Robert Miele, Columbus, OH (US);
Thomas Peter Forte, Columbus, OH (US);
Jimmy Glen Pelham, Bartlesville, OK (US);
William Allen Rogers, Jr., Marysville, OH (US);
Christopher Paul Weil, Pickerington, OH (US);
Robert Dwayne Litt, Westerville, OH (US);
Ronald Chester Pasadyn, Missouri City, TX (US);
George Bradley Smith, Rock Hill, SC (US);
Charles Robert Miele, Columbus, OH (US);
Thomas Peter Forte, Columbus, OH (US);
Jimmy Glen Pelham, Bartlesville, OK (US);
Velocys, Inc., Plain City, OH (US);
Abstract
A process unit comprising: (a) a first microchannel module comprising: (i) a first unit operation including microchannels, in which at least a portion of a unit operation takes place, adapted to be in fluid communication with a first inlet stream and a first outlet stream, and (ii) a second unit operation including microchannels adapted to be in thermal communication with the first unit operation, the second unit operation adapted to be in fluid communication with a second inlet stream and a second outlet stream; and (b) a pressurized vessel at least partially containing the first microchannel module adapted to be concurrently occupied by a compressive medium in thermal communication with the first microchannel module.