The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Sep. 20, 2011
Burton Joyner, Ii, Lexington, KY (US);
Carl Sullivan, Stamping Ground, KY (US);
Frank Anderson, Sadieville, KY (US);
Timothy Strunk, Georgetown, KY (US);
Burton Joyner, II, Lexington, KY (US);
Carl Sullivan, Stamping Ground, KY (US);
Frank Anderson, Sadieville, KY (US);
Timothy Strunk, Georgetown, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.