The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Sep. 14, 2011
Subhash Roy, Lexington, MA (US);
Igor Zhovnirovsky, Newton, MA (US);
Subhash Roy, Lexington, MA (US);
Igor Zhovnirovsky, Newton, MA (US);
Applied Micro Circuits Corporation, San Diego, CA (US);
Volex PLC, London, GB;
Abstract
An optical multi-chip module (MCM) is provided. A printed circuit board (PCB) overlies a package bottom and has die contact regions, each having at least one electrical interface. A first die contact region is formed in a PCB top surface recess, and an optical component die has a bottom surface with an area about matching the PCB top surface recess. The optical component die has an optical port with microlens. An electrical component die has a bottom surface with at least one electrical interface connected to the second die electrical interface, which is connected to the first die electrical interface via a PCB trace. A wire bond is connected between the electrical component die and a package interconnection lead. A cover assembly connector has an optical port with a microlens, configured to communicate with the optical component die optical port, and a fiber port to accept an optical fiber.