The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2013

Filed:

Oct. 09, 2008
Applicants:

Shigeo Iriguchi, Kawasaki, JP;

Kiyoyuki Hatanaka, Kawasaki, JP;

Satoshi Watanabe, Kawasaki, JP;

Nobuo Taketomi, Kawasaki, JP;

Keiichi Yamamoto, Kawasaki, JP;

Masaru Sugie, Kawasaki, JP;

Inventors:

Shigeo Iriguchi, Kawasaki, JP;

Kiyoyuki Hatanaka, Kawasaki, JP;

Satoshi Watanabe, Kawasaki, JP;

Nobuo Taketomi, Kawasaki, JP;

Keiichi Yamamoto, Kawasaki, JP;

Masaru Sugie, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/06 (2006.01); H05K 7/08 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.


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