The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2013

Filed:

Oct. 23, 2009
Applicants:

Hirotaka Kobayashi, Tokyo, JP;

Kentaro Akiyama, Kanagawa, JP;

Naoki Matsushita, Kanagawa, JP;

Takayuki Ezaki, Kanagawa, JP;

Inventors:

Hirotaka Kobayashi, Tokyo, JP;

Kentaro Akiyama, Kanagawa, JP;

Naoki Matsushita, Kanagawa, JP;

Takayuki Ezaki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a semiconductor device layer, a multilayered wiring section formed of a plurality of wiring layers and a plurality of interlayer insulating films on one surface of the semiconductor device layer, an external connection electrode formed on one of the plurality of wiring layers, and an opening formed in a concave shape extending from the semiconductor device layer to the multilayered wiring section so as to expose a surface of the external connection electrode; the opening has a larger opening diameter at an end farther from the external connection electrode than at the other end closer to the external connection electrode.


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