The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Nov. 09, 2010
Dong Gyu Lee, Gyunggi-do, KR;
Dae Young Lee, Gyunggi-do, KR;
Tae Joon Chung, Seoul, KR;
Seon Jae Mun, Gyunggi-do, KR;
Jin Won Choi, Gyunggi-do, KR;
Dong Gyu Lee, Gyunggi-do, KR;
Dae Young Lee, Gyunggi-do, KR;
Tae Joon Chung, Seoul, KR;
Seon Jae Mun, Gyunggi-do, KR;
Jin Won Choi, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.