The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Dec. 02, 2011
Applicants:
Hidetoshi Nakanishi, Tokyo, JP;
Yuji Miyazaki, Tokyo, JP;
Inventors:
Hidetoshi Nakanishi, Tokyo, JP;
Yuji Miyazaki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes an insulating substrate, a metal pattern formed on the insulating substrate, a power terminal bonded onto the metal pattern, and a plurality of power chips bonded onto the metal pattern. The plurality of power chips are all separated from the power terminal by a distance sufficient to thermally isolate the plurality of power chips from the power terminal.