The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8455892 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 04, 2013

Filed:

Jun. 14, 2011
Applicant:

Hiroyuki Fukui, Kyoto, JP;

Inventor:

Hiroyuki Fukui, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED module includes a substrate including a main surface and a rear surface that are opposed to each other. The LED module also includes a plurality of LED chips arranged on the main surface, a drive circuit chip that is provided on the substrate and that is provided for driving the plurality of LED chips, a first heat dissipater that is provided on the rear surface and that overlaps the plurality of LED chips as viewed in the thickness direction of the substrate, and a second heat dissipator that is provided at a position closer to the drive circuit chip than the first heat dissipater is. The second head dissipater has a thickness greater than that of the first heat dissipater. The LED module emits a uniform amount of light and color.


Find Patent Forward Citations

Fukui, Hiroyuki. (2013). Led module and led lighting device (U.S. Patent No. 8455892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8455892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…