The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
May. 06, 2011
Young-jin Lee, Seoul, KR;
Jeong-wook Lee, Gyeonggi-do, KR;
Kyung-mi Moon, Gyeonggi-do, KR;
Young-hee Song, Gyeonggi-do, KR;
Ill-heung Choi, Gyeonddi-do, KR;
Young-jin Lee, Seoul, KR;
Jeong-wook Lee, Gyeonggi-do, KR;
Kyung-mi Moon, Gyeonggi-do, KR;
Young-hee Song, Gyeonggi-do, KR;
Ill-heung Choi, Gyeonddi-do, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.