The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2013

Filed:

Dec. 02, 2010
Applicants:

Yehoshua Yeshurun, Haifa, IL;

Mier Hefetz, Mizpe Harashim, IL;

Meint DE Boer, Enschede, NL;

Erwin J W Berenschot, Winterswijk, NL;

Hans Gardeniers, Hengelo, NL;

Inventors:

Yehoshua Yeshurun, Haifa, IL;

Mier Hefetz, Mizpe Harashim, IL;

Meint De Boer, Enschede, NL;

Erwin J W Berenschot, Winterswijk, NL;

Hans Gardeniers, Hengelo, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.


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