The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
May. 13, 2009
Kazuya Inoue, Tokyo, JP;
Kazuya Inoue, Tokyo, JP;
Miraial Co., Ltd., Tokyo, JP;
Abstract
Wafer protecting grooves () are provided on an innermost wall () of a container body (). The wafer protecting grooves have a cross-sectional configuration in the shape of undulations having bottoms (), which are most distant from an opening (), at respective positions facing the outer edges of semiconductor wafers (W), and having an opening width wider than the thickness of each semiconductor wafer (W). In a normal state, an imaginary line (Q) connecting together the tops of the undulations is inward of or at the same position as the outer edges of the semiconductor wafers (W) facing the imaginary line. Thus, it is possible to obtain superior impact resistance that makes the semiconductor wafers (W) in the container body () unlikely to be damaged even when a large impact is applied thereto by a fall or other handling errors.