The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Aug. 11, 2009
Raj Kumar, Mission Viejo, CA (US);
Monte Dreyer, Rancho Santa Margarita, CA (US);
Michael J. Taylor, Longmont, CO (US);
Ruben Zepeda, Yorba Linda, CA (US);
Raj Kumar, Mission Viejo, CA (US);
Monte Dreyer, Rancho Santa Margarita, CA (US);
Michael J. Taylor, Longmont, CO (US);
Ruben Zepeda, Yorba Linda, CA (US);
DDI Global Corp., St. Louis, MO (US);
Abstract
Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via.