The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Apr. 15, 2011
Applicants:

Tsung-sheng Huang, Tu-Cheng, TW;

Chun-jen Chen, Tu-Cheng, TW;

Duen-yi Ho, Tu-Cheng, TW;

Wei-chieh Chou, Tu-Cheng, TW;

Inventors:

Tsung-Sheng Huang, Tu-Cheng, TW;

Chun-Jen Chen, Tu-Cheng, TW;

Duen-Yi Ho, Tu-Cheng, TW;

Wei-Chieh Chou, Tu-Cheng, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/00 (2013.01);
Abstract

A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.


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