The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2013
Filed:
Jul. 12, 2011
Applicants:
Shinichiro Uemura, Osaka, JP;
Yukio Hiraoka, Hyogo, JP;
Takayuki Kai, Kyoto, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A digital circuit portion () and an analog circuit portion () are formed in a surface portion of a semiconductor substrate (). A via () is formed in a region between the digital circuit portion () and the analog circuit portion (). The via () extends through the semiconductor substrate () from a front surface to a back surface thereof, and is made of a dielectric () having its surface covered by a metal (). The metal () is grounded. Signal interference between the analog circuit portion () and the digital circuit portion () is reduced by the via ().