The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Jun. 02, 2009
Applicants:

Motoji Shiota, Osaka, JP;

Gen Nagaoka, Osaka, JP;

Ichiro Umekawa, Osaka, JP;

Yasuhiro Hida, Osaka, JP;

Yukio Shimizu, Osaka, JP;

Inventors:

Motoji Shiota, Osaka, JP;

Gen Nagaoka, Osaka, JP;

Ichiro Umekawa, Osaka, JP;

Yasuhiro Hida, Osaka, JP;

Yukio Shimizu, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A liquid crystal display device () includes a glass substrate () having an LSI chip () and an FPC board () mounted thereon. A component ACF () made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors () on the glass substrate (). The component ACF () has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip () and the FPC board () which are mounted first. By thus using the large component ACF (), a positional constraint upon adhering the component ACF () to the glass substrate () is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.


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