The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2013
Filed:
Oct. 25, 2011
Applicants:
Sylvia Monsheimer, Haltern am See, DE;
Franz-erich Baumann, Duelmen, DE;
Maik Grebe, Bochum, DE;
Joerg Lohmar, Dortmund, DE;
Inventors:
Sylvia Monsheimer, Haltern am See, DE;
Franz-Erich Baumann, Duelmen, DE;
Maik Grebe, Bochum, DE;
Joerg Lohmar, Dortmund, DE;
Assignee:
Evonik Degussa GmbH, Essen, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 6/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A molding, produced by a layer-by-layer process in which regions of respective polymer pulverulent layers are selectively melted via introduction of electromagnetic energy, where the process employs a powder which comprises at least one homopolyamide prepared via polycondensation of diamines and dicarboxylic acids, wherein the homopolyamide has an enthalpy of fusion of at least 125 J/g and a recrystallization temperature of at least 148° C.