The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Apr. 26, 2007
Darin James Douma, Monrovia, CA (US);
The 'linh Nguyen, San Jose, CA (US);
Hongyu Deng, Saratoga, CA (US);
Martin Kalberer, Redwood City, CA (US);
Maziar Amirkiai, Sunnyvale, CA (US);
Darin James Douma, Monrovia, CA (US);
The 'Linh Nguyen, San Jose, CA (US);
Hongyu Deng, Saratoga, CA (US);
Martin Kalberer, Redwood City, CA (US);
Maziar Amirkiai, Sunnyvale, CA (US);
Finisar Corporation, Sunnyvale, CA (US);
Abstract
A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.