The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Mar. 30, 2007
Katsura Hayashi, Yasu, JP;
Yutaka Tsukada, Yasu, JP;
Kimihiro Yamanaka, Yasu, JP;
Masaharu Shirai, Yasu, JP;
Isamu Kirikihira, Yasu, JP;
Katsura Hayashi, Yasu, JP;
Yutaka Tsukada, Yasu, JP;
Kimihiro Yamanaka, Yasu, JP;
Masaharu Shirai, Yasu, JP;
Isamu Kirikihira, Yasu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth () is provided by arranging single fibers () or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion () made of a resin material having a linear thermal expansion coefficient larger than that of silicon.