The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

May. 24, 2010
Applicants:

Atsushi Komura, Kariya, JP;

Yasuhiro Kitamura, Chiryu, JP;

Nozomu Akagi, Nukata-gun, JP;

Yasutomi Asai, Okazaki, JP;

Inventors:

Atsushi Komura, Kariya, JP;

Yasuhiro Kitamura, Chiryu, JP;

Nozomu Akagi, Nukata-gun, JP;

Yasutomi Asai, Okazaki, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a multilayer wiring substrate and a double-sided multi-electrode chip. The double-sided multi-electrode chip includes a semiconductor chip and has multiple electrodes on both sides of the semiconductor chip. The double-sided multi-electrode chip is embedded in the multilayer wiring substrate in such a manner that the double-sided multi-electrode chip is not exposed outside the multilayer wiring substrate. The electrodes of the double-sided multi-electrode chip are connected to wiring layers of the multilayer wiring substrate.


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