logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8446002 B1

PDFFull Text
Date of Patent:
May. 21, 2013

Filed:

Mar. 02, 2010

Multilayer wiring substrate having a castellation structure

Applicants:

Noriko Shibuta, Aichi, JP;

Tohru Terasaki, Aichi, JP;

Tomoyasu Yamada, Aichi, JP;

Nobuo Naito, Aichi, JP;

Yukihiko Tsukuda, Aichi, JP;

Ryu Nonoyama, Aichi, JP;

Inventors:

Noriko Shibuta, Aichi, JP;

Tohru Terasaki, Aichi, JP;

Tomoyasu Yamada, Aichi, JP;

Nobuo Naito, Aichi, JP;

Yukihiko Tsukuda, Aichi, JP;

Ryu Nonoyama, Aichi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:

Rader Fishman & Grauer, PLLC

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/12 (2006.01); H01L 27/15 (2006.01); H01L 29/267 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 29/73 (2006.01); H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 31/00 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.

Find Patent Forward Citations

Shibuta, Noriko. (2013). Multilayer wiring substrate having a castellation structure (U.S. Patent No. 8446002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8446002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…