The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Feb. 24, 2010
Applicants:
Young-gon Kim, Cupertino, CA (US);
Nikhil Vishwanath Kelkar, San Jose, CA (US);
Louis Elliott Pflughaupt, Los Gatos, CA (US);
Inventors:
Young-Gon Kim, Cupertino, CA (US);
Nikhil Vishwanath Kelkar, San Jose, CA (US);
Louis Elliott Pflughaupt, Los Gatos, CA (US);
Assignee:
Intersil Americas Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.