The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

Feb. 28, 2012
Applicants:

Hiroshi Furuta, Kanagawa, JP;

Takayuki Shirai, Kanagawa, JP;

Shunsaku Naga, Kanagawa, JP;

Inventors:

Hiroshi Furuta, Kanagawa, JP;

Takayuki Shirai, Kanagawa, JP;

Shunsaku Naga, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor integrated circuit device, includes a first electrode including a first semiconductor layer formed on a substrate, a side surface insulating film formed on at least a part of a side surface of the first electrode, an upper surface insulating film formed on the first electrode and the side surface insulating film, a second electrode which covers the side surface insulating film and the upper surface insulating film, and a fin-type field effect transistor. The first electrode, the side surface insulating film, and the second electrode constitute a capacitor element. A thickness of the upper surface insulating film between the first electrode and the second electrode is larger than a thickness of the side surface insulating film between the first electrode and the second electrode, and the fin-type field effect transistor includes a second semiconductor layer which protrudes with respect to the plane of the substrate.


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