The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8445827 B1

PDF
Full Text
Expired
Date of Patent:
May. 21, 2013

Filed:

Apr. 22, 2010
Applicants:

Kyohei Mizuta, Kanagawa, JP;

Kazuichiro Itonaga, Kanagawa, JP;

Inventors:

Kyohei Mizuta, Kanagawa, JP;

Kazuichiro Itonaga, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solid state imaging device is described that includes a semiconductor substrate having a plurality of photodiodes thereon. The solid state imaging device further includes a first wiring portion, a second wiring portion and a third wiring portion. The device further includes a first wiring layer over the semiconductor substrate and which includes a plurality of metal films and extends across all the wiring portions. Additionally, a second wiring layer is disposed over the first wiring layer and which extends across the first wiring portion and the second wiring portion.


Find Patent Forward Citations

Mizuta, Kyohei. (2013). Multi-wiring layer solid-state imaging device with increased sensitivity, electronic apparatus, and method for manufacturing same (U.S. Patent No. 8445827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8445827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…