The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Feb. 18, 2011
Applicants:
Jin Ha Jeong, Yongin-si, KR;
Jung-ho Kim, Suwon-si, KR;
Kihyun Hwang, Seongnam-si, KR;
Yong-hoon Son, Yongin-si, KR;
Inventors:
Jin Ha Jeong, Yongin-si, KR;
Jung-Ho Kim, Suwon-si, KR;
Kihyun Hwang, Seongnam-si, KR;
Yong-Hoon Son, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods for fabricating a semiconductor device are provided. In the methods, first material layers and second material layers may be alternatingly and repeatedly stacked on a substrate. An opening penetrating the first material layers and the second material layers may be formed. A semiconductor solution may be formed in the opening by using a spin-on process.
Jeong, Jin. (2013). Methods of fabricating semiconductor devices (U.S. Patent No. 8445317). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8445317
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile