The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Jul. 12, 2010
Akio Shibuya, Kanagawa, JP;
Katsuyoshi Tsuchiya, Kanagawa, JP;
Akira Imaizumi, Kanagawa, JP;
Hiroshi Matsumoto, Kanagawa, JP;
Shoji Tsuchioka, Kanagawa, JP;
Akio Shibuya, Kanagawa, JP;
Katsuyoshi Tsuchiya, Kanagawa, JP;
Akira Imaizumi, Kanagawa, JP;
Hiroshi Matsumoto, Kanagawa, JP;
Shoji Tsuchioka, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
An electrical characteristics test for a semiconductor integrated circuit using a Kelvin contact method can be conducted in a pre-process without obstructing the reduction in size of a semiconductor chip or without complicating the circuit design. A probe card in a testing apparatus includes probes for Kelvin contact, the probes for Kelvin contact including a coil probe and a POGO pin probe disposed inside the coil probe, and a probe for two-terminal measurement. Electrode pads formed in each chip area over a wafer are in a relation of A=B<2A, given that the area of one of the electrode pads with which the probe for Kelvin contact comes into contact is B and the area of the other electrode pad with which the probe for two-terminal measurement comes into contact is A.