The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

Dec. 03, 2009
Applicants:

Alexander Ermochkine, Chapel Hill, NC (US);

Derek Schorzman, Cary, NC (US);

Jacob Sprague, Chapel Hill, NC (US);

Inventors:

Alexander Ermochkine, Chapel Hill, NC (US);

Derek Schorzman, Cary, NC (US);

Jacob Sprague, Chapel Hill, NC (US);

Assignee:

Liquidia Technologies, Inc., Morrisville, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B27N 3/18 (2006.01); B29C 59/02 (2006.01); B29C 35/08 (2006.01); B32B 27/00 (2006.01); B32B 3/00 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.


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