The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Aug. 26, 2010
Kiyoshi Aratake, Chiba, JP;
Kiyoshi Aratake, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
An anodic bonding method of anodically bonding a base waferand a lid waferincludes:(1) superimposing the base waferand the lid waferonto each other in a direction where a bonding filmfaces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base waferand the lid waferin a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A, A, Aand Ain a concentric form on a contacting surface where the base waferand the lid waferare in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A, A, Aand A.