The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Sep. 02, 2010
Hironori Fukaya, Yokohama, JP;
Yuzo Shimobeppu, Yokohama, JP;
Kazuhiro Yoshimoto, Yokohama, JP;
Kazuo Teshirogi, Yokohama, JP;
Kazuyuki Uragou, Yokohama, JP;
Mika Sakamoto, Yokohama, JP;
Masaya Tazawa, Yokohama, JP;
Hironori Fukaya, Yokohama, JP;
Yuzo Shimobeppu, Yokohama, JP;
Kazuhiro Yoshimoto, Yokohama, JP;
Kazuo Teshirogi, Yokohama, JP;
Kazuyuki Uragou, Yokohama, JP;
Mika Sakamoto, Yokohama, JP;
Masaya Tazawa, Yokohama, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.