The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

Oct. 19, 2007
Applicants:

Shinji Soma, Handa, JP;

Koji Morita, Anjo, JP;

Tomohiro Inagaki, Anjo, JP;

Takayuki Moroto, Okazaki, JP;

Kazuhiko Sugita, Anjo, JP;

Tomoyasu Imai, Kariya, JP;

Yasuji Kunihiro, Hekinan, JP;

Inventors:

Shinji Soma, Handa, JP;

Koji Morita, Anjo, JP;

Tomohiro Inagaki, Anjo, JP;

Takayuki Moroto, Okazaki, JP;

Kazuhiko Sugita, Anjo, JP;

Tomoyasu Imai, Kariya, JP;

Yasuji Kunihiro, Hekinan, JP;

Assignees:

JTEKT Corporation, Osaka-shi, JP;

Toyoda Van Moppes Ltd., Okazaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A grinding wheel is manufactured such that (a) any one of particles for an abrasive grain layer and particles for a substrate layer are put into the press-mold die, and other particles are put onto the particles in the press-mold die, and then the substrate layer and the abrasive grain layer are integrally press-molded to form a non-baked grinding chip with an arcuate shape; (b) depressions are formed on the abrasive grain layer of the non-baked grinding chip; (c) the grinding chip on which the depressions are formed is baked; and (d) the plurality of baked-grinding chips are adhered to a core of the grinding wheel.


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