The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

May. 18, 2011
Applicants:

Chris Bakker, Corvallis, OR (US);

Lawrence H. White, Corvallis, OR (US);

Bjorn Warloe, Portland, OR (US);

Reynaldo V. Villavelez, Corvallis, OR (US);

Paul I. Mikulan, Carrollton, TX (US);

Kenneth Stewart, Coppell, TX (US);

Michael Allen Godwin, Corvallis, OR (US);

Teck-khim Neo, Singapore, SG;

Joseph M. Torgerson, Philomath, OR (US);

Lonnie Byers, Corvallis, OR (US);

Inventors:

Chris Bakker, Corvallis, OR (US);

Lawrence H. White, Corvallis, OR (US);

Bjorn Warloe, Portland, OR (US);

Reynaldo V. Villavelez, Corvallis, OR (US);

Paul I. Mikulan, Carrollton, TX (US);

Kenneth Stewart, Coppell, TX (US);

Michael Allen Godwin, Corvallis, OR (US);

Teck-Khim Neo, Singapore, SG;

Joseph M. Torgerson, Philomath, OR (US);

Lonnie Byers, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.


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